Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
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United States of America Patent
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Dec 13, 2011
Grant Date -
Jul 10, 2008
app pub date -
Oct 5, 2005
filing date -
Nov 29, 2004
priority date (Note) -
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Abstract
A polishing pad includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of conducting polishing elements each affixed to the compressible under-layer and passing through a sealed contact with a proton exchange membrane and corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate. The polishing pad may also include a slurry distribution material fastened to the guide plate by an adhesive. Pad wear sensors may also be provided in the polishing pad.
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