Methods of providing semiconductor components within sockets
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United States of America Patent
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Dec 13, 2011
Grant Date -
Jan 1, 2009
app pub date -
Sep 11, 2008
filing date -
May 3, 2006
priority date (Note) -
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Abstract
The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.
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