Circuit device with at least partial packaging and method for forming
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United States of America Patent
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Dec 6, 2011
Grant Date -
Jun 19, 2008
app pub date -
Feb 28, 2008
filing date -
Apr 18, 2003
priority date (Note) -
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Abstract
A circuit device is placed within an opening of a conductive layer which is then partially encapsulated with an encapsulant so that the active surface of the circuit device is coplanar with the conductive layer. At least a portion of the conductive layer may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device may be placed on a conductive layer such that an active surface of circuit device is between conductive layer and an opposite surface of circuit device. The conductive layer has at least one opening to expose the active surface of circuit device. The encapsulant may be electrically conductive or electrically non-conductive.
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