Ion implantation device and a method of semiconductor manufacturing by the implantation of boron hydride cluster ions

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United States of America Patent

PATENT NO 8071958
SERIAL NO

12268524

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Abstract

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A method of manufacturing a semiconductor device includes the steps of: providing a supply of molecules containing a plurality of dopant atoms into an ionization chamber, ionizing said molecules into dopant cluster ions, extracting and accelerating the dopant cluster ions with an electric field, selecting the desired cluster ions by mass analysis, modifying the final implant energy of the cluster ion through post-analysis ion optics, and implanting the dopant cluster ions into a semiconductor substrate. In general, dopant molecules contain n dopant atoms, where n is an integer number greater than 10. This method enables increasing the dopant dose rate to n times the implantation current with an equivalent per dopant atom energy of 1/n times the cluster implantation energy, while reducing the charge per dopant atom by the factor n.

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Patent Owner(s)

Patent OwnerAddress
SEMEQUIP INC34 SULLIVAN ROAD UNIT #21 BILLERICA MA 01862

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Horsky, Thomas N Boxborough, US 57 2744
Jacobson, Dale C Salem, US 24 627

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