Silver paste for forming conductive layers
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United States of America Patent
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Dec 6, 2011
Grant Date -
Aug 5, 2010
app pub date -
May 25, 2007
filing date -
Jan 30, 2007
priority date (Note) -
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Abstract
The present invention provides a silver paste for forming electrically conductive pattern comprising 0.1 to 60 wt % of a silver C0 to C12 aliphatic carboxylate; 1 to 80 wt % of silver powder; 0.1 to 15 wt % of a binder; and a residual organic solvent.The silver paste composition according to the present invention has advantages in that it produces micro-structures of layers denser than those conventional metal pastes do; shows characteristics of a much lower electric resistance even with a relatively small thickness or a small line width, as compared with the electrically conductive pattern formed from a conventional paste; and allows heat treatment at a very low temperature even without the use of expensive nano-sized metal particles.
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