Method of assembling an insulated metal substrate
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United States of America Patent
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Dec 6, 2011
Grant Date -
Feb 26, 2009
app pub date -
Aug 21, 2008
filing date -
Aug 24, 2007
priority date (Note) -
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Abstract
An insulated metal substrate laminate includes a metal substrate, a dielectric layer disposed upon the metal substrate, wherein the dielectric layer comprises a thermoplastic film having a thickness of less than or equal to 10 micrometers, a thermal resistance of less than or equal to 0.050 Kelvin-square inches per watt, and a breakdown voltage greater than or equal to 1000 volts (alternating current), and an electrically conductive layer disposed upon the dielectric layer.
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