Encapsulated RFID device for flexible, non-planar or curvilinear surfaces
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United States of America Patent
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Nov 29, 2011
Grant Date -
Apr 1, 2010
app pub date -
Sep 26, 2008
filing date -
Sep 26, 2008
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Abstract
An encapsulated device and method for fabricating a radio frequency identification (RFID) device is disclosed herein. The method includes providing a first substrate layer, the first substrate layer including at least one cavity; placing a RFID tag into the cavity; placing a second substrate layer over the first substrate layer, the at least one cavity of the first substrate layer being covered by the second substrate layer; and attaching the second substrate layer to the first substrate layer, the second substrate layer forming a pocket with the first substrate layer.
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