Chip scale package having flip chip interconnect on die paddle
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United States of America Patent
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Nov 29, 2011
Grant Date -
Aug 31, 2006
app pub date -
Nov 15, 2005
filing date -
Nov 15, 2004
priority date (Note) -
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Abstract
A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.
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