Method and device for placing thin material layers onto a relief mould
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United States of America Patent
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Nov 29, 2011
Grant Date -
Jan 8, 2009
app pub date -
Sep 18, 2006
filing date -
Sep 20, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a method and a device for placing at least one material layer onto a relief mold for producing a composite material. Thereby, an elastically-reversibly deformable body with a surface relief that is designed to correspond to the relief mold is pressed against the material layer, as a result of which the surface of said body is deformed, and the material layer can be picked up. As a result of its elastically-reversible characteristics the body subsequently deforms back to its initial state so that the material layer can easily be placed onto the relief mold.
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