Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields
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United States of America Patent
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Nov 22, 2011
Grant Date -
Apr 26, 2007
app pub date -
Nov 27, 2006
filing date -
Oct 22, 2004
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Abstract
A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.
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