Alumina taphole fill material and method for manufacturing
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United States of America Patent
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Nov 22, 2011
Grant Date -
Oct 14, 2010
app pub date -
Apr 10, 2009
filing date -
Apr 10, 2009
priority date (Note) -
Expired
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Abstract
A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.
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