Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof

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United States of America Patent

PATENT NO 8061414
APP PUB NO 20080104970A1
SERIAL NO

11793535

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Abstract

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A boil cooling method forms, with a surface of an object to be cooled or a surface of a heating member in close contact with the surface of the object to be cooled made to serve as a cooling surface, a main flow channel and a sub-flow channel for a cooling liquid from the side of the cooling surface in the above-described order, arranges a plurality of nozzles penetrating a partition wall separating the sub-flow channel and the main flow channel and protruding into the main flow channel in a flow channel direction of the main flow channel, causes tip end parts of individual nozzles to be in the vicinity of or in contact with the cooling surface, causes a cooling liquid to circulate to the main flow channel and the sub-flow channel, and cools the cooling surface by boiling of the cooling liquid flowing through the main flow channel, and at the same time, supplies the cooling liquid from the side of the sub-flow channel through each of the nozzles to the vicinity of the cooling surface, and cools the cooling liquid in the main flow channel.

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Patent Owner(s)

Patent OwnerAddress
TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION ADMINISTRATIVE ORGANIZATIONSHINJUKU-KU TOKYO 162-8601

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Yoshiyuki Tsukuba, JP 133 1339
Kawamura, Hiroshi Tokyo, JP 140 1879
Ohta, Haruhiko Fukuoka, JP 3 13
Suzuki, Koichi Tokyo, JP 389 3939

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