Anodized metal substrate module

United States of America Patent

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Nov 15, 2011
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Sep 20, 2007
app pub date
Mar 16, 2007
filing date
Mar 17, 2006

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Abstract

An anodized metal substrate module superior in heat radiation properties and reduced in manufacturing costs. A metal plate is provided. An anodized film is formed on the metal plate. A heat generating device is mounted on the metal plate. Also, a conductive line is formed on the anodized film.

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Patent Owner	Address
SAMSUNG ELECTRONICS CO LTD	129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

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Inventor Name	Address	# of filed Patents	Total Citations
Choi, Seog Moon	Seoul, KR	100	1042
Lee, Young Ki	Seoul, KR	116	900
Shin, Sang Hyun	Gyunggi-Do, KR	83	1536
Yoon, Young Bok	Gyunggi-Do, KR	105	657

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Anodized metal substrate module

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United States of America Patent

11723059

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PATENT NO	8058781
APP PUB NO	20070217221A1
SERIAL NO	11723059
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 15, 2011	US,8058781,B2 US8058781B2	GRANTED PATENT AS SECOND PUBLICATION
September 20, 2007	US,20070217221,A1 US20070217221A1	FIRST PUBLISHED PATENT APPLICATION

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11723059

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