Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition
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United States of America Patent
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Nov 15, 2011
Grant Date -
Apr 15, 2010
app pub date -
Mar 4, 2008
filing date -
Mar 5, 2007
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Abstract
A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material for an electrically insulating coating.
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