Adhesive tape for electronic components
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United States of America Patent
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Nov 15, 2011
Grant Date -
Dec 21, 2006
app pub date -
Aug 5, 2005
filing date -
Oct 22, 2004
priority date (Note) -
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Abstract
An adhesive tape for attaching and fixing electronic components has an adhesive layer on at least one surface of a heat-resistant film. The surface hardness of the adhesive layer is about more than 25 MPa, and the surface hardness of the adhesive layer is about more than 80 MPa after thermosetting at 200° C. for about one hour.
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