Method and device for measuring soil parameters by means of compaction machines
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United States of America Patent
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Nov 15, 2011
Grant Date -
Jul 2, 2009
app pub date -
Feb 19, 2007
filing date -
Feb 22, 2006
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Abstract
A soil compaction device has a vibrated contact element that makes contact with the soil during a contact phase and that is exposed to a contact force exerted by the soil and travels over a contact distance. A dynamic stiffness of the soil is formed from the gradient of the contact force and from the contact distance. Furthermore, a contact surface parameter to take account of the actual contact surface of the contact element with the soil is determined. The dynamic deformation modulus is then the product of the contact surface parameter and the dynamic stiffness. The method allows the determination of the dynamic deformation modulus, and hence of the soil stiffness, during the compaction operation.
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