Combination wedge bonding and ball bonding transducer
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United States of America Patent
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Nov 15, 2011
Grant Date -
Apr 10, 2008
app pub date -
Oct 8, 2007
filing date -
Oct 9, 2006
priority date (Note) -
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Abstract
A transducer configured for use with a manual wire bonding machine includes a body portion including an end portion, the end portion defining a bonding tool aperture configured to receive at least a portion of a bonding tool. The transducer also includes a first tightening mechanism for securing a ball bonding tool in the bonding tool aperture, and a second tightening mechanism for securing a wedge bonding tool in the bonding tool aperture. The first tightening mechanism is distinct from the second tightening mechanism.
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