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United States of America Patent

PATENT NO 8053877
APP PUB NO 20100176467A1
SERIAL NO

12612225

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor package includes a chip base material; a capacitor formed on the base material; and a cover formed over the base material to cover the capacitor, and having a side portion and an upper portion. The base material is provided with a bonding pattern connecting the base material and the cover to cover the capacitor. The bonding pattern includes a region A having a substantially uniform pattern width A, and at least one region B having a pattern width B which is larger than the width pattern width A.

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Patent Owner(s)

Patent OwnerAddress
MICRO-OPTIMUS TECHNOLOGIES INC600 ANTON BLVD SUITE 1350 COSTA MESA CA 92626

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukasawa, Ryo Kanagawa, JP 28 313
Sawada, Tatsuhiro Niigata, JP 4 65

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1702407123365539219115410570614515901 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0200400600800100012001400160018002000220024002600

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