Semiconductor device and method of fabrication thereof
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United States of America Patent
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Nov 1, 2011
Grant Date -
Nov 19, 2009
app pub date -
Jul 27, 2009
filing date -
Jun 21, 2001
priority date (Note) -
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Abstract
A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.
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