Electronic component comprising predominantly organic functional materials and a method for the production thereof
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United States of America Patent
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Oct 25, 2011
Grant Date -
Feb 2, 2006
app pub date -
Jul 9, 2003
filing date -
Jul 29, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic component comprises a plurality of layers at least two of which comprise predominantly organic functional materials with improved through-plating through certain of the layers. The through-plating is formed in one embodiment by a disruption element on a first lower layer which results in a void in the subsequently applied layers, which void is filled with a material which may be conductive to form the through plating. In a second embodiment, the through plating is formed on the first lower layer prior to the subsequent application of the other layers, in the form of a free-standing truncated frusto-conical raised portion, and forms a disruption or non-welting element for the subsequently applied other layers, formed on the first lower layer and which are engaged with and surround the through plating after their application.
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