Interposer, semiconductor chip mounted sub-board, and semiconductor package
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United States of America Patent
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Oct 25, 2011
Grant Date -
Oct 30, 2008
app pub date -
Jun 30, 2008
filing date -
Jul 12, 2006
priority date (Note) -
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Abstract
A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on.Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible.
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