Micropump and adhesive-free method for joining two substrates
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United States of America Patent
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Oct 25, 2011
Grant Date -
Jan 4, 2007
app pub date -
Dec 20, 2004
filing date -
Dec 19, 2003
priority date (Note) -
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Abstract
The invention relates to a device provided with channel-type structures for transporting and/or storing a liquid and/or gaseous medium. The device comprises a first (1) substrate layer and a second substrate layer (2), and a functional element (3) that is sandwiched between the first and second substrate layers, the channel-type structures being embodied in the first and/or second substrate layer. The first and second substrate layers are solidly and permanently interconnected, and the functional element is clamped between the first and second substrate layers. The functional element is elastic, the first and second layers are rigid, and the channel-type structures in the first and/or second substrate layers are at least partially sealed in a gas-tight and/or liquid-tight manner due to the functional element.
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