Noncontact IC label and method and apparatus for manufacturing the same
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United States of America Patent
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Oct 25, 2011
Grant Date -
Feb 21, 2008
app pub date -
Oct 7, 2005
filing date -
Oct 13, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A non-contact IC label comprising an electrically insulating first substrate; an electrically connected antenna coil and IC chip provided on one surface of said substrate; a magnetic layer provided on said one surface of said substrate so as to cover said antenna coil and said IC chip, a first adhesive layer provided on said magnetic layer, an electrically insulating second substrate provided on said first adhesive layer, a second adhesive layer provided on said second substrate, a release paper provided on said second adhesive layer, and an overlay material provided on a third adhesive layer on the other surface of said first substrate.
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