Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module
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United States of America Patent
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Oct 18, 2011
Grant Date -
Jul 16, 2009
app pub date -
Jan 30, 2007
filing date -
Jan 30, 2006
priority date (Note) -
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Abstract
The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is corrugated at least in part so as to define an alternating sequence of oppositely-directed arcs, a first series of arcs being connected to the conductive face of the electronic component. The conductor also includes a second series of arcs opposite to the arcs of the first series and interposed between the arcs of the first series, the second series of arcs being connected to the conductive face of the connection member.
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