Printed wiring board with built-in semiconductor element, and process for producing the same
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United States of America Patent
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Oct 11, 2011
Grant Date -
Apr 21, 2011
app pub date -
Dec 13, 2010
filing date -
Jan 13, 2006
priority date (Note) -
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Abstract
A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
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