Large die package structures and fabrication method therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 11, 2011
Grant Date -
Jun 10, 2010
app pub date -
Feb 19, 2010
filing date -
Apr 30, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully