MEMS package and packaging method thereof
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United States of America Patent
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Oct 11, 2011
Grant Date -
Apr 22, 2010
app pub date -
Jul 25, 2007
filing date -
Dec 7, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.
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