Sputtering target, method for producing same, sputtering thin film formed by using such sputtering target, and organic EL device using such thin film

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United States of America Patent

PATENT NO 8029655
APP PUB NO 20090127108A1
SERIAL NO

11996550

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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powder and/or a Ti powder, is pressed and sintered. The sintered body has a composition of SiαTiβOγ wherein α, β and γ are mole ratios of Si, Ti and O, respectively, and the ratio of α/β ranges from 0.45 to 7.25 and the ratio of γ/(α+β) ranges from 0.80 to 1.70.

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Patent Owner(s)

  • OSAKA TITANIUM TECHNOLOGIES CO., LTD.;ROHM CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azuma, Kazuomi Amagasaki, JP 10 66
Kido, Jyunji Yonezawa, JP 1 0
Mori, Koichi Fujisawa, JP 116 899
Natsume, Yoshitake Amagasaki, JP 7 72
Ogasawara, Tadashi Amagasaki, JP 46 420

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