Sensor device and production method therefor
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United States of America Patent
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Sep 27, 2011
Grant Date -
Sep 24, 2009
app pub date -
Nov 24, 2006
filing date -
Nov 25, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.
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