Carrier module for use in a handler and handler for handling packaged chips for a test using the carrier modules

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United States of America Patent

PATENT NO 8026516
APP PUB NO 20080121561A1
SERIAL NO

11987186

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Abstract

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Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.

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Patent Owner(s)

Patent OwnerAddress
MIRAE CORPORATIONCHUNAN-SHI CHOONGCHUNGNAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
An, Jung Ug Cheonan-si, KR 3 11
Beom, Hee Rak Seoul, KR 10 16
Yun, Dae Gon Gumi-si, KR 3 5

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