Method for manufacturing electronic circuit component
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United States of America Patent
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Sep 27, 2011
Grant Date -
Jan 7, 2010
app pub date -
Aug 3, 2007
filing date -
Aug 7, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
, which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200° C. or lower which has no influence on the above-mentioned plastic substrate.
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