Interconnect structures comprising capping layers with low dielectric constants and methods of making the same
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United States of America Patent
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Sep 27, 2011
Grant Date -
Feb 18, 2010
app pub date -
Aug 12, 2008
filing date -
Aug 12, 2008
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Expired
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Abstract
disposed upon the second capping layer, wherein a+b+c+d=1.0 and a, b, c, and d are each greater than 0 and less than 1, and wherein w+x+y+z=1.0 and w, x, y, and z are each greater than 0 and less than 1.
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