Semiconductor device and method of manufacturing the same
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United States of America Patent
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Sep 27, 2011
Grant Date -
Jul 1, 2010
app pub date -
Oct 21, 2009
filing date -
Dec 26, 2008
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor device, includes steps of forming an organic insulating film over a semiconductor substrate, irradiating an electron beam to a surface of the organic insulating film, forming recesses in the organic insulating film, forming a conductive material over the organic insulating film and in the recesses, and removing the conductive material on the organic insulating film by a polishing to expose the surface of the organic insulating film and to leave the conductive material buried in recesses of the organic insulating film.
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