Method for producing electronic components and pressure sensor
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United States of America Patent
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Sep 27, 2011
Grant Date -
Jan 1, 2009
app pub date -
Jan 30, 2007
filing date -
Feb 15, 2006
priority date (Note) -
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Abstract
A method produces electronic components in particular electronic sensors for pressure and differential pressure measurement. Firstly, the semiconductor structure of the electronic components is produced on a wafer. An insulating oxide layer is then applied. A protective metal layer is subsequently applied. The metal layer is applied in sections only in those regions of the wafer in which no splitting, for example by mechanical separation, occurs later. The electronic components thus formed in the wafer are then divided up into individual elements.
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