Au-Ag based alloy wire for semiconductor package
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United States of America Patent
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Sep 20, 2011
Grant Date -
Dec 6, 2007
app pub date -
May 23, 2007
filing date -
May 30, 2006
priority date (Note) -
Expired
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Abstract
A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.
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