Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board

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United States of America Patent

PATENT NO 8018733
SERIAL NO

12965530

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Abstract

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A circuit board interconnection system is disclosed according to the embodiments of the present invention. The system includes a first circuit board, a second circuit board, a third circuit board, a first connector and a second connector. The first connector and the second connector are mounted at two sides of the first circuit board respectively so that the second circuit board mounted on the first connector is perpendicular to the third circuit board on the second connector. The first connector and the second connector mounted respectively at two sides of the first circuit board are coupled to each other via an impedance controlled mechanism on the first circuit board. Another circuit board interconnection system, a circuit board, a connector assembly and a method for manufacturing a circuit board are disclosed according to the present invention. The circuit board adopts the impedance controlled mechanism which has a shielding function and an impedance controlled function to replace a via hole on the existing circuit board where the via hole has an uncontrollable resistance.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HUAWEI TECHNOLOGIES CO LTD518129 BANTIAN HUAWEI HEADQUARTERS OFFICE BUILDING LONGGANG DISTRICT GUANGDONG SHENZHEN SHENZHEN CITY GUANGDONG PROVINCE 518129

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jia, Gongxian Shenzhen, CN 8 151

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