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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ACACIA RESEARCH GROUP LLC	767 3RD AVE 6TH FLOOR NEW YORK NY 10017

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Furusawa, Takeshi	Tokyo, JP	60	732
# of filed Patents : 60 Total Citations : 732
Goto, Kinya	Tokyo, JP	20	152
# of filed Patents : 20 Total Citations : 152
Matsuura, Masazumi	Tokyo, JP	45	973
# of filed Patents : 45 Total Citations : 973
Miura, Noriko	Tokyo, JP	26	176
# of filed Patents : 26 Total Citations : 176

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Patent Citation Ranking

• 4 Citation Count
• H01L Class

• 3.01 % this patent is cited more than
• 14 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 13, 2011	US,8018030,B2   US8018030B2	GRANTED PATENT AS SECOND PUBLICATION
July 30, 2009	US,20090189245,A1   US20090189245A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8018030

Semiconductor chip with seal ring and sacrificial corner pattern

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