Flattening mechanism for dry film laminator
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United States of America Patent
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Sep 13, 2011
Grant Date -
Aug 4, 2011
app pub date -
Feb 3, 2010
filing date -
Feb 3, 2010
priority date (Note) -
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Abstract
A flattening mechanism for dry film laminator includes a lower member connected to a dry film laminator. The lower member has a base portion formed thereon. The base portion has a plurality of air holes defined therein. The lower member has a lifting holder movably disposed thereon for holding a wafer. The wafer has a dry film disposed thereon. An upper member is movably disposed above the lower member. The upper member has a pressing portion disposed on a bottom thereof. The pressing portion has a steel plate disposed thereon and a first electric heating layer mounted on a top of the steel. A release film is movably guided between the upper member and the lower member, such that the wafer is lifted to press against the steel plate via the release film for enhancing a lamination of the dry film to the wafer and flattening the dry film.
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