Leadless alignment of a semiconductor chip
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United States of America Patent
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Sep 6, 2011
Grant Date -
Jun 25, 2009
app pub date -
Dec 22, 2007
filing date -
Dec 22, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is disclosed a mounting technique for mounting a semiconductor chip of the leadless or so-called flip chip type to a header. The header has an insert made of glass or other suitable non-conductive material within the header hollow. Mounted into the glass insert are a series of conductive metal pins which are placed in areas so that when a chip is mounted in the header, the chip makes contact with these conductive pins and allows one to make outside connections. Also positioned in the header are a series of nonconductive guide pins. These pins are placed in suitable positions in the header to enable one to contact the outside surfaces of the chip when the chip is placed in the header. In this manner, the chip is constrained from movement from side to side or from rotation. However, due to the positioning of the nonconductive pins within the header, it is possible to move the chip up and down while mounting.
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