Substrate connecting connector and semiconductor device socket, cable connector, and board-to-board connector having substrate connecting connector

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United States of America Patent

PATENT NO 8011933
APP PUB NO 20100297857A1
SERIAL NO

12751715

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electrode terminal supporting body fixed on a printed wiring board and an anisotropic conductive sheet which is positioned on the electrode terminal supporting body and on which a semiconductor device is placed are provided between first and second stiffening plates. The first and second stiffening plates are fastened by machine screws with the electrode terminal supporting body, the anisotropic conductive sheet, and the printed wiring board interposed therebetween.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
YAMAICHI ELECTRONICS CO LTD2-16-2 MINAMIKAMATA OTA-KU TOKYO 144-8581

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Toshiyasu Tougane, JP 113 1529

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