Electron beam apparatus and method of generating an electron beam irradiation pattern

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United States of America Patent

PATENT NO 8008622
APP PUB NO 20100078555A1
SERIAL NO

12630346

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Abstract

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High-contrast exposure is performed by use of a small dose of electron beams, a pattern is formed on a wafer with high accuracy, and high-precision inspection is performed. In pattern formation, proximity effect correction processing is performed. Moreover, exposure of electron beams is performed based on a result of filtering using an inverse characteristic of exposure characteristics of the electron beams. Furthermore, in pattern inspection, electron beams are irradiated based on a result of filtering for obtaining a peripheral region of an edge of the pattern formed.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATIONTOKYO 105-6409

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Kimiaki Hamura, JP 28 386
Fujita, Ryo Hitachi, JP 99 1094
Inoue, Yuji Hitachinaka, JP 175 3436
Muraki, Masato Inagi, JP 102 2654
Yoda, Haruo Hinode, JP 80 1333

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