Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
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United States of America Patent
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Aug 30, 2011
Grant Date -
Dec 11, 2008
app pub date -
Jun 11, 2007
filing date -
Jun 11, 2007
priority date (Note) -
Expired
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Abstract
A method is provided comprising: coating an electrically conductive core with a first removable material, creating openings in the first removable material to expose portions of the electrically conductive core, plating a conductive material onto the exposed portions of the electrically conductive core, coating the conductive material with a second removable material, removing the first removable material, electrophoretically coating the electrically conductive core with a dielectric coating, and removing the second removable material.
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