Simulated patina for copper
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United States of America Patent
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Aug 30, 2011
Grant Date -
Dec 3, 2009
app pub date -
Nov 26, 2008
filing date -
Jul 17, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for imparting a simulated patina appearance to a copper substrate including selecting a colorant having the desired initial patina color tone and producing a noncontinuous layer of the colorant on a surface of the copper substrate to provide the appearance of patination of the desired tone via interspersed spots of the colorant. The remaining portion of the substrate is exposed for natural patination.
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