Family

Loading Family data...

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MITSUBISHI HEAVY INDUSTRIES LTD	TOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

• F03D:WIND MOTORS
• G01W:METEOROLOGY

• 2008 Application Filing Year
• F03D Class
• 482 Applications Filed
• 272 Patents Issued To-Date
• 56.44 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Matsushita, Takatoshi	Nagasaki, JP	51	605
# of filed Patents : 51 Total Citations : 605

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

• 3 Citation Count
• F03D Class

• 0 % this patent is cited more than
• 14 Age

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 30, 2011	US,8006552,B2   US8006552B2	GRANTED PATENT AS SECOND PUBLICATION
April 01, 2010	US,20100077850,A1   US20100077850A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9615444

Manufacturing of a heat sink by wave soldering

---

Abstract

---

An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.

---

 

---

Description

---

Claims

---

Claims data not available

---

Legal Events

 

• FEPP2024
• AS2022
• MAFP2020
• I2017
• STCF2017
• P2016
• F2015
• PD2013

Date	Code	Event	Description
Nov 25, 2024	FEPP	FEE PAYMENT PROCEDURE	free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
May 30, 2022	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:STMICROELECTRONICS S.R.L.;REEL/FRAME:060301/0355 Owner name: STMICROELECTRONICS INTERNATIONAL N.V., SWITZERLAND Effective Date: May 30, 2022
Sep 19, 2020	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Apr 04, 2017	I	Issuance
Mar 15, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Mar 17, 2016	P	Published
Nov 24, 2015	F	Filing
Apr 05, 2013	PD	Priority Date