Process for forming a patterned thin film structure on a substrate
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United States of America Patent
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Aug 23, 2011
Grant Date -
Mar 27, 2008
app pub date -
Jul 12, 2007
filing date -
Apr 24, 2002
priority date (Note) -
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Abstract
A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.
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