Adhesive tape and semiconductor package using the same
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United States of America Patent
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Aug 16, 2011
Grant Date -
Jul 29, 2010
app pub date -
Dec 16, 2009
filing date -
Jan 23, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided is an adhesive tape which adheres two members to each other and decreases problems that may occur due to contraction and expansion of the adhered members when the temperature of the adhered two members changes. The adhesive tape includes: a base film having insulating properties; and an adhesive agent that adheres on both sides of the base film, wherein a coefficient of thermal expansion of the base film is 10 ppm or lower, a coefficient of thermal expansion of the adhesive tape is lower than 17 ppm, and an occupation rate of the base film in the adhesive tape exceeds 50%.
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