Light emitting module and method for manufacturing the same
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United States of America Patent
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Aug 16, 2011
Grant Date -
Mar 26, 2009
app pub date -
Sep 25, 2008
filing date -
Sep 25, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided are: a light emitting module which has an improved heat-dissipating property and whose reflectance reduction is prevented. The light emitting module mainly includes: a metal substrate; a conductive pattern formed on the upper surface of the metal substrate; and a light emitting element disposed on the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, in the light emitting module, an insulating layer is removed in a region where the conductive pattern is not formed, but is left unremoved in a region right below (or covered with) the conductive pattern. In other words, in the region where the conductive pattern is not formed, the upper surface of the metal substrate is not covered with the conductive pattern, and a metal material constituting the metal substrate is exposed.
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