Multilayered polymeric structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 16, 2011
Grant Date -
Nov 19, 2009
app pub date -
Aug 20, 2007
filing date -
Jun 14, 2000
priority date (Note) -
Expired
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Abstract
A multilayered polymeric structure having at least two polymeric layers is provided, each layer being a mixture of a polymeric composition with carbon fibrils. The multilayer polymeric structure may include an electrically conductive material between the first and second polymeric layers. A process for making a multilayered polymeric structure for packaging electronic components is also provided. The multilayered polymeric material is used to form trays and packages for containing electrical components.
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