Electroplating method
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United States of America Patent
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Aug 16, 2011
Grant Date -
Jun 25, 2009
app pub date -
Jun 30, 2008
filing date -
Dec 19, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.
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