Semiconductor device and method for manufacturing the same
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United States of America Patent
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Aug 9, 2011
Grant Date -
May 7, 2009
app pub date -
Nov 3, 2008
filing date -
Nov 7, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device may include a chip including a chip including a silicon substrate having a semiconductor device area, a pad area and a scribe lane defining an outer contour of the chip. A semiconductor device may be formed in the semiconductor device area, and a pad electrically connected with the semiconductor device may be formed in the pad area. A crack prevention pattern may be formed on an outer contour of the chip, such that the crack prevention pattern extends from a lowest portion to a highest portion of the semiconductor device. A crack prevention pattern is manufactured such that chip cracking can be prevented during the sawing process.
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